T&VS report brings together leaders in design verification
As part of the UK’s National Microelectronics Institute’s verification roadmapping project, T&VS has produced a report that, for the first time, brings together high-profile semiconductor companies, CAD vendors and universities in proposed projects that aim to solve urgent challenges in design verification.
Design verification in the semiconductor industry is an essential but difficult and complicated process. Each company has its own expertise and faces its own challenges. To better understand these challenges, foster collaboration and develop a design verification roadmap for the UK semiconductor industry, NMI, with co-sponsorship from the Electronics KTN, engaged T&VS to run round-table meetings and produce a report involving major players from the NMI’s established verification network to collaborate on research projects and work towards a roadmap for design verification.
T&VS interviewed verification managers and engineers in the major UK semiconductor companies and ran workshops to allow them to share their verification challenges. From this, a number of potential collaborative near- and long-term projects were defined to help overcome these challenges. These involve high-profile semiconductor companies (such as ARM, Infineon, Imagination, Icera, TI, Broadcom, DisplayLink, XMOS), CAD vendors (such as Cadence, Mentor Graphics) and several universities.
- “With ever-increasing costs of fabrication and pressures to get quickly to market, NMI sees Design Verification as a critical point in the design cycle. We were delighted to work with T&VS on this project and we are now taking the outcomes forward. T&VS were natural candidates to lead this project on our behalf due to their clear expertise and wealth of experience in verification.” Derek Boyd CEO of the NMI
The NMI report, produced by T&VS is available on the NMI website entitled: Verification Roadmapping