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Blurring Lines Between SoCs, PCBs And Packages

Leading-edge chipmakers, foundries and EDA companies are pushing into 3nm and beyond, and they are encountering a long list of challenges that raise questions about whether the entire system needs to be shrunk onto a chip or into a package.

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Find out how T&VS Hardware Verification services help to meet the challenging requirements with respect to performance, flexibility and verify today’s complex designs effectively.

18th March, 2020|Blog, Thought Leadership|