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Challenges Grow for Finding Chip Defects

Several equipment makers are developing or ramping up a new class of wafer inspection systems that address the challenges in finding defects in advanced chips.The new inspection systems promise to address the challenges, but they are also more expensive than the previous tools, and chipmakers may need to buy a mix of them.This article outlines how challenges are growing for finding new chip defects.

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4th October, 2019|Blog, Thought Leadership|