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Finding Defects in IC Packages

Several equipment makers are ramping up new inspection equipment to address the growing defect challenges in IC packaging.At one time, finding defects in packaging was relatively straightforward. But as packaging becomes more complex, and as it is used in markets where reliability is critical, finding defects is both more difficult and more important.This article elaborates how to find defect in IC packages.

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3rd January, 2020|Blog, Thought Leadership|