The reality of DFT for large and complex SoCs has introduced new risk into design schedules. DFT teams end up in the critical path to tape out while waiting for portions of the design to be complete, and there are more DFT integration steps than ever before. The traditional approaches to DFT work on huge designs pose problems of repeatability and reliability.
With more DFT steps, the overall rate of success declines unless the rate of success at each step is extremely high. This article from Semiengineering explores how do you ensure an extremely high rate of success at each step in the DFT flow by adopting a smarter technology.
Explore how T&VS effectively deliver end-to-end DFT support from design all the way to silicon.