Adding system-level, post-layout electrical analysis to HDAP design and verification

High-density advanced packaging (HDAP) offerings from both OSAT companies and traditional IC foundries are increasing in number and expanding in design options every day.Adoption of HDAP needs tools and supports to build designers’ confidence in the emerging technology. This article shows how to add system-level and post-layout electrical analysis to HDAP design and verification.

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Find out how T&VS Verification services help to meet the challenging requirements with respect to performance, flexibility and verify today’s complex designs effectively.

2018-11-29T05:49:42+00:0029th November, 2018|Blog, Thought Leadership|